By Clare Jim TAINAN, Taiwan (Reuters) - Top contract chip maker TSMC may have outsmarted rivals Samsung Electronics Co and Intel Corp in the race to build the tiniest and most powerful chips for smartphones and tablets by building big. As mobile devices get slimmer and demand increases for more data-processing and power-saving features, chip companies are trying to cram more power into tinier chips and are building futuristic factories, or fabs, to meet global demand. ...



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